Positioning and use of sensor and electronic components can be limited with the surrounding conditions - exposure to elevated temperatures, oil, static and dynamic loads… however, with the advancement in material development and innovations in production technologies, new ways have emerged that offer complete protection of electronic components without any assembly steps.
Existing technologies, such as hot melt and potting were until now the dominant methods of electronic protection by using polymer materials; however, long cycle times and expensive polymer solutions are their main drawbacks.
Plastic injection moulding allows short cycle times and great cost efficiency, but large filling pressures (500 – 1000 bar) and high melting temperatures (220 – 340 °C) were the main technical obstacles of using the technology as an encapsulation method of electronic components. Until now.
With the development of specialized low viscosity thermoset materials, sensors and electronic components can be overmoulded with filling pressures of up to 50 bar and melt temperatures up to 100 °C. Not only have the encapsulating thermosets a protective function, but due to their excellent temperature resistance, high mechanical properties (tensile modulus, tensile strength), and their ability to reach complex shapes, they can turn a conventional electronic housing into a multi-functional, load-carrying, structural part.
Halle A5 – Stand A5-5228
Halbzeuge, Technische Teile und verstärkte Kunststoff-Erzeugnisse