Duresco GmbHHall B4 - Stand B4-4306
Epoxy Moulding Compound with increased thermal conductivity
For applications with increased heat dissipation requirements, Duresco is pleased to present the product NU 6640 X.
This new product on the market offers the following advantages:
- Increased, isotropic heat dissipation
- Good price/performance ratio
- Optimised cycle time
- ...more
Duresco GmbH
