Product novelty 26. August 2026

Sciengy Unveils Advanced Special Engineering Plastic Solutions for Next-Generation Industries

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AI Data Center Solutions
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Humanoid Robot Solutions
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Automotive ADAS Solutions
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Semiconductor Solutions
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Aerospace Solutions
Sciengy introduces a new portfolio of special engineering plastic solutions developed for AI data centers, humanoid robots, new energy vehicle ADAS, semiconductor manufacturing, and aerospace applications.

For AI data centers, our innovative MT ferrule material offers higher heat resistance and a lower coefficient of thermal expansion (CTE) than conventional PPS solutions, helping maintain dimensional stability and reduce signal loss after demanding assembly processes. Our high-performance cooling fan materials provide exceptional mechanical strength and dimensional precision for high-RPM operation. Sciengy also offers locally sourced PEI-based compounds and custom-colored grades with performance comparable to leading international alternatives.

For humanoid robots, our PEEK, PEI, and PPS solutions are tailored to the specific requirements of different components. We deliver the dimensional precision required for joints, dexterous hands, and other high-accuracy motion systems, while unfilled, colorable PEI grades expand aesthetic and functional design possibilities.

For automotive ADAS, our portfolio supports camera lens barrels, holders and spacers, 4D radar waveguides, and LiDAR internal structural components. These materials meet demanding automotive requirements for mechanical performance and dimensional reliability. Metal replacement also enables weight reduction, greater production efficiency, enhanced design flexibility, and improved cost effectiveness.

Built on independently developed, locally produced PEI resin, our semiconductor solutions cover wafer handling and transport, chip packaging and testing, and precision fixtures.

For aerospace and other extreme environments, Sciengy offers PEI compounds for aircraft interiors and 3D printing; TPI materials for radiation-resistant, low-temperature, and high-strength applications; and soluble PI solutions for composite toughening, heat-resistant insulating coatings, and gas-separation membranes.