Product novelty 14. October 2026
Low pressure moulding
Hesco Kunststoffverarbeitung GmbH offers an innovative technology: electronics encapsulation using Low Pressure Moulding (LPM). This is an innovative low-pressure injection molding process designed to provide a protective coating for sensitive electrical and electronic components. Thermoplastic hot-melt adhesives are injected into a mold at low pressure, precisely encapsulating the components. The process is suitable for applications such as printed circuit boards, sensors, connectors, and cable assemblies.
The technology protects electronic assemblies against moisture, dust, dirt, vibrations, and mechanical stress. Key advantages include the gentle processing of pressure-sensitive components, short cycle times, the elimination of additional curing times, and the ability to directly integrate sealing and housing functions. Low Pressure Moulding thus provides an efficient, cost-effective solution for the reliable encapsulation and protection of electronic components across a wide range of industrial applications.
Elektronikverguss, Niederdruckverguss, Low Pressure Moulding, Low Pressure Molding, LPM, Elektronikverkapselung, electronic encapsulation, electronic potting, Hotmelt Moulding, Hotmelt Molding, thermoplastische Schmelzklebstoffe, thermoplastic hotmelt, Leiterplatten, printed circuit boards, PCB protection, Sensorverguss, sensor encapsulation, Steckverbinder, connectors, Kabelabdichtung, cable sealing, Feuchtigkeitsschutz, moisture protection, Staubschutz, dust protection, Vibrationsschutz, vibration protection, Bauteilschutz, component protection, Dichtungstechnik, sealing technology, Gehäuseintegration, housing integration, industrielle Elektronik, industrial electronics, Fakuma, Produktneuheiten, Showroom.
The technology protects electronic assemblies against moisture, dust, dirt, vibrations, and mechanical stress. Key advantages include the gentle processing of pressure-sensitive components, short cycle times, the elimination of additional curing times, and the ability to directly integrate sealing and housing functions. Low Pressure Moulding thus provides an efficient, cost-effective solution for the reliable encapsulation and protection of electronic components across a wide range of industrial applications.
Elektronikverguss, Niederdruckverguss, Low Pressure Moulding, Low Pressure Molding, LPM, Elektronikverkapselung, electronic encapsulation, electronic potting, Hotmelt Moulding, Hotmelt Molding, thermoplastische Schmelzklebstoffe, thermoplastic hotmelt, Leiterplatten, printed circuit boards, PCB protection, Sensorverguss, sensor encapsulation, Steckverbinder, connectors, Kabelabdichtung, cable sealing, Feuchtigkeitsschutz, moisture protection, Staubschutz, dust protection, Vibrationsschutz, vibration protection, Bauteilschutz, component protection, Dichtungstechnik, sealing technology, Gehäuseintegration, housing integration, industrielle Elektronik, industrial electronics, Fakuma, Produktneuheiten, Showroom.
hesco Kunststoffverarbeitung GmbH
Contact
Ms. Yuliia Dubinchuk