hesco Kunststoffverarbeitung GmbHHall A5 - Stand A5-5106

hesco Kunststoffverarbeitung GmbH 14. October 2026

Low pressure moulding

Hesco Kunststoffverarbeitung GmbH offers an innovative technology: electronics encapsulation using Low Pressure Moulding (LPM). This is an innovative low-pressure injection molding process designed to provide a protective coating for sensitive electrical and electronic components. ...more

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hesco Kunststoffverarbeitung GmbH 13. October 2026

Smart Technology Integration for High-Strength, Ultra-Lightweight Plastic Components

hesco combines advanced manufacturing technologies to produce high-strength, ultra-lightweight and cost-efficient plastic components: • Physical and chemical foam injection moulding • Fibre-reinforced thermoplastics (GFRP/CFRP, long glass and carbon fibres) • Core-back technology / ...more

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